Supply Chain
Chips & componentsChips, components, packaging, and the industrial chain behind AI hardware.
Changsha UWB Chipmaker Chixin Closes A+ Round Led by Yanpu Precision
Changsha-based Chixin Semiconductor has closed an A+ round of more than 200 million yuan led by Yanpu Precision, with Quectel, Hunan Jinxia Shengshi and Changsha Lushan Investment also joining. The company will use the proceeds to push automotive-grade UWB chips into production and expand its physical AI spatial sensing work.
T-Head Reveals Zhenwu V900 Chip and Panjiu Super-Node, Both Due in 2027
Alibaba's T-Head has unveiled the Zhenwu V900, a unified training-and-inference AI chip delivering triple the performance of the Zhenwu M890, with 216GB of memory, 1,200GB/s chip-to-chip interconnect, and FP8/FP4 support. Mass production is slated for the first quarter of 2027 alongside the new Panjiu super-node server.
Xili Photonics Raises Pre-A Round to Push Thin-Film Lithium Niobate Chips Toward Mass Production
Hangzhou-based Xili Photonics has closed a Pre-A round led by Fortune Capital, reportedly in the hundreds of millions of yuan, to fund R&D and mass-production validation of thin-film lithium niobate photonic chips. The startup, founded in January 2025, is targeting optical interconnect for AI data centers with comb light sources, modulator chips and photonic engines.
Kaifa Technology Plans 1.85 Billion Yuan Storage Chip Packaging Expansion, Targets 2.5D and 3DS Advanced Packaging
SDGI subsidiary Peyton Technology plans to invest 1.85 billion yuan in high-end memory chip packaging and testing, including new 2.5D and 3DS capacity. The projects are due in December 2028 amid modest memory-segment growth, rising borrowings and uncertainty over the industry cycle.
On-Device AI Chip Maker Guangyu Xinchen Raises Series A as TC1000 Enters Mass Production
Shanghai-based Guangyu Xinchen has closed a Series A round, bringing its total raised over the past six months to 2 billion yuan. The startup says its first on-device large-model inference chip, the TC1000, has entered mass-production deployment while its second-generation chip moves to tape-out.
Superxon Unveils 1.6T Optical Module and High-Power ELSFP at CIOE 2026
Superxon showcased a prototype 1.6T optical module and high-power ELSFP external laser sources designed for AI data-center interconnects and NPO/CPO architectures at CIOE 2026. The company also displayed 800G, 400G and PON products.
Karrie International Starts Mass Production of Vera Rubin Chassis and Rack Products
Karrie International says it has begun mass production and deliveries of chassis and rack-level mechanical products supporting NVIDIA’s Vera Rubin platform. The Hong Kong-listed manufacturer is also expanding its ASIC server business, although it disclosed no customers, order values or shipment volumes.
China’s AI Compute Boom Lifts Servers, Optical Modules and Storage
Chinese listed companies across the AI compute supply chain reported strong first-half 2026 growth as server, optical-module and storage orders moved into delivery. Rising inventories and long acceptance cycles, however, leave cash flow and capital turnover as key tests of sustainability.
Yutai Micro revises private placement plan, seeking 689 million yuan to develop high-speed interconnect chips for data centers
On Sept. 2, 2026, Yutai Micro released the second revised draft of its feasibility analysis report on the use of proceeds from its 2026 A-share offering to targeted investors. The company plans to raise no more than 688.9528 million yuan. After deducting issuance expenses, the proceeds will go toward two projects: research and development of high-speed interconnect solutions for data centers, and the development and commercialization of high-speed automotive communication chips.
Oriental Semiconductor Releases White Paper on AI Server Power Supply Systems
Oriental Semiconductor has outlined a portfolio of power devices and digital control chips for AI server power systems, spanning PSUs, intermediate bus converters and voltage regulator modules. Its roadmap includes expanded 48V products, an 800V architecture and research into devices rated at 1,500V and above.
Samsung Showcases Three Storage Solutions for AI Infrastructure in Beijing
Samsung Semiconductor showcased the PM1763, BM1773 and zNAND-O at ODX 2026 in Beijing, targeting the performance, capacity and cost requirements of next-generation AI infrastructure.
Why Ascend 950PR Could Be the Core Investment Theme in the Second Half of 2026
Huawei’s Ascend 950PR, slated for release in the second half of 2026, marks a critical shift for domestic AI computing power from “usable” to “good enough to deploy at scale.
DeepSeek’s One Line Sent Domestic Chip Stocks Soaring. What Exactly Is UE8M0 FP8?
After DeepSeek V3.1 was released, one official comment set China’s AI community buzzing:
Chinese GPU Players Convene an Open-Source Gathering, Bringing in Core Developers From SGLang and Beyond
There were no executives from major tech companies on stage, but the room was packed with familiar faces from the open-source community.
After Years Away, AI Chips Are Again the Star of a Huawei Launch
Huawei’s chip cadence has moved onto a new track across the board.
Zero GPUs, World’s No. 1 Supercomputer: Shenzhen Manufacturing Rewrites the Rules
The World’s Most Powerful Supercomputer Has a New Owner
Who Can Solve AI’s Computing Power Hunger and Energy Trap? Two Post-95 Founders Are Building a New Paradigm With Phase-Change Optical Computing
Synced Editorial Team
How Can SRAM Help Solve the GPU Shortage as Inference Demand Surges?
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The First Year of Capitalization for Chinese AI Computing Power Chips: Vimicro Takes the Lead, Enflame Clears Review, and xFusion Is Accepted
Macro Introduction: Three Forces Shaping China’s AI Computing Power Chip Industry
NVIDIA Reports Fiscal Q1 2026 Results, With H20 Restrictions Driving $8 Billion Hit
NVIDIA has released its results for the first quarter of fiscal 2026, showing steady performance. But the company expects roughly $8 billion in lost H20 revenue due to export control restrictions, a hit that may show up in the next quarterly report.
A Look at the 2026 Top 30 AI Chip Companies: These Six Are Already in the IPO Sprint
A Look at the 2026 Top 30 AI Chip Companies: These Six Are Already in the IPO Sprint
2026 China AI Chip Industry Watch: A Latest Analysis of AI Computing Power Chip Companies Planning Listings
In 2026, the "Xingyuan Agent," built on "Starlight Smart No. 5," was officially released. Based on a self-developed multi-core heterogeneous XPU processor architecture, the agent offers full domestic controllability, high security, and broad compatibility. It can work with mainstream open-source large models, support standalone operation or cluster expansion, and quickly build industry-specific AI data center systems. ...
2026 Semiconductor M&A Wave: 250 Deals Reshape the Supply Chain
2026 Semiconductor M&A Wave: 250 Deals Reshape the Supply Chain as Domestic Substitution Enters an Accelerated Consolidation Phase, production lines, supply chain, M&A wave, semiconductor devices
China's Optical Chips Enter a Golden Window to Move Upmarket
China’s optical chip sector has been gaining momentum recently, with supportive signals from policy, industry and capital markets. In June 2026, the Ministry of Industry and Information Technology formally issued the Implementation Opinions on Innovative Development of “AI + Information and Communications,” calling for stronger R&D in core technologies including high-end optoelectronic chips, CPO and all-optical switching. Overseas giants such as NVIDIA and Meta have committed billions of dollars to secure optical interconnect capacity. Falling prices and rising shipments of 800G optical modules, together with pilot production of 1.6T modules, are helping meet the bandwidth demands of AI computing power networks...
2026 China AI Chip Inference Acceleration Test: An Analysis of Inference-Specific, Full-Stack Self-Developed, and General-Purpose Technology Paths
Introduction
Domestic GPU Direct-Connect Test Shows Throughput Surge and Latency Halved Without NVIDIA NICs
From July 17 to 20, the 2026 World Artificial Intelligence Conference and High-Level Meeting on Global AI Governance (WAIC 2026) opened simultaneously across “three zones and four venues” in Shanghai: the World Expo area, Zhangjiang, and West Bund.
Tencent-Backed Chipmaker Heads for Listing: Enflame Technology’s IPO Accepted, Seeks 6 Billion Yuan for an All-In R&D Push
The first newly accepted A-share IPO application of 2026 has landed in China’s homegrown AI chip sector.
The Chip Behind Luckin Can No Longer Stay Hidden
The chip behind Luckin Coffee can no longer stay hidden.
China’s First Pure Inference GPU Unicorn Valued Above 10 Billion Yuan Is Born: Xiwang Co-CEO Wang Zhan on Why the Lowest Inference Cost Wins
Hangzhou speed” is becoming an increasingly weighty phrase.
Hong Kong’s First General-Purpose GPU Stock Is Also Racing Toward Market: Harvard PhD Founder, 20.9 Billion Yuan Valuation
China’s Domestic GPU Players Line Up for the New Year
A New Dark Horse Emerges in Chinese GPUs: Two Chips Reach Mass Production Less Than a Year After Founding
The Cards Are Here. Now What?