Supply Chain
Chips & componentsChips, components, packaging, and the industrial chain behind AI hardware.
MetaX Targets AI Inference Efficiency With Heterogeneous Compute Rack
MetaX has introduced its XiJing S600 128-GPU supernode and a dual-engine rack developed with Dongfang Suanxin that separates attention and expert workloads in mixture-of-experts inference. The systems aim to improve interconnect performance, deployment efficiency and hardware utilization in large AI clusters.
Kuaishou Spinoff Lingchuan Raises 1 Billion Yuan, Skips General-Purpose GPUs for Video-Only Chips
Lingchuan Technology, spun out of Kuaishou in March 2024, has raised 1 billion yuan in a Series B round co-led by Yitang Shenghe Fund, Qiming Venture Partners and Zhaohui Capital. Its SL200 video-only inference chip has shipped close to 100,000 units into data centers at Kuaishou, Alibaba Cloud, Baidu Cloud and Bilibili.
China's Neuromorphic Super Node Takes On FFN Workloads in AI Inference
A heterogeneous inference system from Beijing Lynxi Technologies, China Mobile (Suzhou) Software Technology and the CETC Nanhu Research Institute splits Transformer workloads, leaving Attention on GPUs while brain-inspired KA200 chips handle FFN and MoE expert layers. The design was named one of ten flagship debut achievements at the Light of the Internet Expo during the 2026 World Internet Conference.
Accelink Breaks Ground on 10.2 Billion Yuan Optical Module Expansion
Accelink Technologies has broken ground on a 10.2 billion yuan expansion in Wuhan focused on high-speed optical modules, silicon photonics, CPO and NPO optical engines, and all-optical switching. The project is designed for annual production of more than 10 million high-speed optical modules.
Yitai Intelligent Raises Over 200 Million Yuan to Scale Edge Switch Chips
High-speed interconnect chip designer Yitai Intelligent said on November 2, 2026 that it had closed a Series A round of more than 200 million yuan, with the A3 tranche led by Wuxi Venture Capital alongside Jintou Zhiyuan and Hongshan Capital. The proceeds target volume delivery of its edge-side switch chips and senior hiring, as the company pushes from automotive and industrial Ethernet into AI superpod interconnect.
Innolight, Eoptolink, T&S Pour Cash Upstream as Inventories and Prepayments Balloon
Innolight, Eoptolink and T&S Communications booked a combined 35.694 billion yuan in attributable net profit for the first three quarters on strong 800G and 1.6T demand, yet generated only 10.934 billion yuan of operating cash flow. Inventories and prepayments jumped at all three as they locked in upstream materials.
Two Years From Founding to Volume: XHEART Unveils X7 Ultra, Reports 200,000 Chips Shipped
XHEART unveiled its X7 Ultra assisted-driving chip in Suzhou on October 29, claiming 700 TOPS for large models measured on production models with 98.7% NPU utilization. The company also set targets for its next-generation X9 chip at 3,000 TOPS and 700GB/s of single-chip memory bandwidth, due in 2027.
China Mobile Names Five Candidates for 20,480-Card AI Super-Node Buy
China Mobile has published a candidate-winner notice for its 2026-2027 AI super-node procurement of 20,480 accelerator cards, with five bidders quoting full-volume prices within 1% of each other around 11.7 billion yuan. All five sit inside Huawei's Kunpeng partner ecosystem, and no award notice or contract has been issued.
Iluvatar CoreX Shows Tiangai 300 Running Live, Claims 1.05x H200 Throughput
Iluvatar CoreX demonstrated its Tiangai 300 general-purpose GPU on live hardware for the first time at a Shanghai media open day, saying third-party tests put its normalized per-card throughput at 1.05 times NVIDIA's H200. The company also detailed its IXL144 super node, heterogeneous AFD disaggregation results, and the 300 TOPS Tongyang TY1200 on-device chip.
T&S Communications Q3 Revenue Up 31.5% as Optical Component Demand Surges
T&S Communications reported third-quarter 2026 revenue of 1.923 billion yuan, up 31.50%, and net profit of 879 million yuan, up 55.30%, citing global AI and data center demand for high-speed optical components. Nine-month figures imply a gross margin of 62.56%, up 10.69 percentage points, while inventory and contract liabilities rose sharply.
Yizhu Technology Raises Over 1 Billion Yuan as 3D DRAM Compute-in-Memory Chip Completes Tape-Out
Suzhou-based Yizhu Technology said on October 23 it had raised more than 1 billion yuan to fund R&D and commercialization, with its fully digital, general-purpose compute-in-memory AI chip built on 3D DRAM now through tape-out. Headline performance claims against NVIDIA's H200 come from an FPGA simulation platform rather than silicon under real workloads.
Xinai Technology Raises Nearly 1.5 Billion Yuan for High-End Packaging Substrates
Nanjing-based Xinai Technology has closed an A2 round of nearly 1.5 billion yuan, with proceeds going to high-end FCBGA substrate capacity, glass substrate development and localization of core materials. The company says its products cleared qualification at JCET, Huatian and TongFu within seven months of sampling.
The Math Behind China's Smuggled GPU Premium Doesn't Add Up
Grey-market prices for eight-GPU NVIDIA B300 servers in China have reportedly reached 18 million to 20 million yuan, roughly five times US retail, stretching payback to six years or more. Buyers keep competing for them anyway as token demand surges and legitimate supply stays closed.
DAMO Academy's XuanTie E908A Claims First RISC-V CPU IP Certified to ASIL-B and ASIL-D
At the RISC-V Summit China in Shenzhen on October 19, Alibaba's DAMO Academy introduced the automotive-enhanced XuanTie E908A, which it says is the first RISC-V CPU IP to meet both ASIL-B and ASIL-D. The academy also published its first processor roadmap for autonomous driving and embodied intelligence and detailed server and Agentic AI gains for the XuanTie C950.
CXMT Forecasts 131-132.5 Billion Yuan Nine-Month Profit, Reversing Year-Earlier Loss
CXMT expects revenue of 265-270 billion yuan and attributable net profit of 131-132.5 billion yuan for the first three quarters of 2026, reversing a 5.28 billion yuan year-earlier loss as AI demand drives a DRAM upcycle. The company disclosed on the same day that its chairman has proposed a share buyback of 1-2 billion yuan.
Zhongxingwei Launches Full-Stack Interconnect Chip Platform, Claims China's First PCIe 6.0 Switch
Chinese interconnect chip maker Zhongxingwei used a Wuxi launch event to show a full-scenario platform spanning general-purpose and AI computing interconnect, saying cumulative shipments top 800,000 chips and 12 products are in volume production. It also signed strategic agreements with seven partners including Kylin, UnionTech, Tencent Cloud, Inspur, H3C, ZTE and Lenovo.
Axera Launches AX8860 Chip Series for Edge and On-Device Large Models
Axera used CIIF 2026 in Shanghai to launch its AX8860 high-compute series, a 6 nm edge AI chip rated at 256 TOPS with 128 GB of LPDDR5X memory and native FP4 support, aimed at running large models on factory floors and devices. The company also released the Yuanxi A256S module and showed inference cards and servers, positioning a continuous product range from chips to systems.
Non-GPU Accelerators Overtake GPUs in China's AI Chip Market, IDC Says
IDC data cited by Reuters puts NVIDIA at 34% of China's data center AI chip market in the first half, with shipments down 44% year-on-year while Huawei reached 572,000 units and a 28% share. Non-GPU accelerators grew nearly 80% to 1.016 million units, outshipping GPUs for the first time.
Black Sesame Says Next-Gen Huashan A2000 Chip Family Is Now in Full Mass Production
Black Sesame Technologies' Huashan A1000 automotive-grade autonomous-driving chip has been named to the third round of Hubei's "Hubei Premium Products" list, with the company citing 58 TOPS at a typical 18W and dual ISO 26262 ASIL-B and AEC-Q100 Grade 2 certification. The company says its next-generation A2000 family, built for physical AI, has now fully entered mass production.
Samsung Q3 Operating Profit Jumps Nearly Eightfold on AI Memory Demand
Samsung Electronics said preliminary third-quarter 2026 operating profit reached 107.4 trillion won, up nearly eightfold year-on-year and its first quarter above the 100 trillion won mark, driven by AI-related memory demand and HBM shipment growth. The same price surge is raising component costs for Samsung's own smartphone and consumer electronics units.
Huawei Launches Mate 90 Series With Kirin 9050 Pro, Touting 28% Higher Transistor Density
Huawei launched its Mate 90 series in Beijing on October 1, with all five models running in-house Kirin chips across three tiers, topped by the Kirin 9050 Pro and its 3D "logic folding" architecture. Rising memory prices pushed starting prices up 1,000 to 1,500 yuan versus the previous generation, with sales opening the same day as the announcement.
Changsha UWB Chipmaker Chixin Closes A+ Round Led by Yanpu Precision
Changsha-based Chixin Semiconductor has closed an A+ round of more than 200 million yuan led by Yanpu Precision, with Quectel, Hunan Jinxia Shengshi and Changsha Lushan Investment also joining. The company will use the proceeds to push automotive-grade UWB chips into production and expand its physical AI spatial sensing work.
T-Head Reveals Zhenwu V900 Chip and Panjiu Super-Node, Both Due in 2027
Alibaba's T-Head has unveiled the Zhenwu V900, a unified training-and-inference AI chip delivering triple the performance of the Zhenwu M890, with 216GB of memory, 1,200GB/s chip-to-chip interconnect, and FP8/FP4 support. Mass production is slated for the first quarter of 2027 alongside the new Panjiu super-node server.
Xili Photonics Raises Pre-A Round to Push Thin-Film Lithium Niobate Chips Toward Mass Production
Hangzhou-based Xili Photonics has closed a Pre-A round led by Fortune Capital, reportedly in the hundreds of millions of yuan, to fund R&D and mass-production validation of thin-film lithium niobate photonic chips. The startup, founded in January 2025, is targeting optical interconnect for AI data centers with comb light sources, modulator chips and photonic engines.
Kaifa Technology Plans 1.85 Billion Yuan Storage Chip Packaging Expansion, Targets 2.5D and 3DS Advanced Packaging
SDGI subsidiary Peyton Technology plans to invest 1.85 billion yuan in high-end memory chip packaging and testing, including new 2.5D and 3DS capacity. The projects are due in December 2028 amid modest memory-segment growth, rising borrowings and uncertainty over the industry cycle.
On-Device AI Chip Maker Guangyu Xinchen Raises Series A as TC1000 Enters Mass Production
Shanghai-based Guangyu Xinchen has closed a Series A round, bringing its total raised over the past six months to 2 billion yuan. The startup says its first on-device large-model inference chip, the TC1000, has entered mass-production deployment while its second-generation chip moves to tape-out.
Superxon Unveils 1.6T Optical Module and High-Power ELSFP at CIOE 2026
Superxon showcased a prototype 1.6T optical module and high-power ELSFP external laser sources designed for AI data-center interconnects and NPO/CPO architectures at CIOE 2026. The company also displayed 800G, 400G and PON products.
Karrie International Starts Mass Production of Vera Rubin Chassis and Rack Products
Karrie International says it has begun mass production and deliveries of chassis and rack-level mechanical products supporting NVIDIA’s Vera Rubin platform. The Hong Kong-listed manufacturer is also expanding its ASIC server business, although it disclosed no customers, order values or shipment volumes.
China’s AI Compute Boom Lifts Servers, Optical Modules and Storage
Chinese listed companies across the AI compute supply chain reported strong first-half 2026 growth as server, optical-module and storage orders moved into delivery. Rising inventories and long acceptance cycles, however, leave cash flow and capital turnover as key tests of sustainability.
Yutai Micro revises private placement plan, seeking 689 million yuan to develop high-speed interconnect chips for data centers
On Sept. 2, 2026, Yutai Micro released the second revised draft of its feasibility analysis report on the use of proceeds from its 2026 A-share offering to targeted investors. The company plans to raise no more than 688.9528 million yuan. After deducting issuance expenses, the proceeds will go toward two projects: research and development of high-speed interconnect solutions for data centers, and the development and commercialization of high-speed automotive communication chips.
Oriental Semiconductor Releases White Paper on AI Server Power Supply Systems
Oriental Semiconductor has outlined a portfolio of power devices and digital control chips for AI server power systems, spanning PSUs, intermediate bus converters and voltage regulator modules. Its roadmap includes expanded 48V products, an 800V architecture and research into devices rated at 1,500V and above.
Samsung Showcases Three Storage Solutions for AI Infrastructure in Beijing
Samsung Semiconductor showcased the PM1763, BM1773 and zNAND-O at ODX 2026 in Beijing, targeting the performance, capacity and cost requirements of next-generation AI infrastructure.
Why Ascend 950PR Could Be the Core Investment Theme in the Second Half of 2026
Huawei’s Ascend 950PR, slated for release in the second half of 2026, marks a critical shift for domestic AI computing power from “usable” to “good enough to deploy at scale.
DeepSeek’s One Line Sent Domestic Chip Stocks Soaring. What Exactly Is UE8M0 FP8?
After DeepSeek V3.1 was released, one official comment set China’s AI community buzzing:
Chinese GPU Players Convene an Open-Source Gathering, Bringing in Core Developers From SGLang and Beyond
There were no executives from major tech companies on stage, but the room was packed with familiar faces from the open-source community.
After Years Away, AI Chips Are Again the Star of a Huawei Launch
Huawei’s chip cadence has moved onto a new track across the board.
Zero GPUs, World’s No. 1 Supercomputer: Shenzhen Manufacturing Rewrites the Rules
The World’s Most Powerful Supercomputer Has a New Owner
Who Can Solve AI’s Computing Power Hunger and Energy Trap? Two Post-95 Founders Are Building a New Paradigm With Phase-Change Optical Computing
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How Can SRAM Help Solve the GPU Shortage as Inference Demand Surges?
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