Changsha Chixin Semiconductor Technology Co., Ltd. has closed an A+ funding round of more than 200 million yuan. The round was led by Shanghai Yanpu Precision Technology (Group) Co., Ltd., with joint participation from Hunan Jinxia Shengshi Equity Investment Fund, Shanghai Quectel Wireless Solutions Co., Ltd. and Changsha Lushan Investment Holding Group Co., Ltd.

The proceeds will go mainly toward bringing automotive-grade UWB chips into production programs, R&D on physical AI spatial sensing technology, volume production and product iteration, and building out the industry ecosystem.

Focused on UWB Chips and Spatial Sensing

Founded in Changsha, Chixin Semiconductor develops and sells ultra-wideband (UWB) chips, with the aim of becoming a supplier of communications and positioning chips.

UWB delivers high-precision wireless ranging and positioning, giving devices more accurate information about where they are in space. As smart homes, automotive electronics, smart radar, robots and XR devices advance, demand is growing for indoor positioning, short-range sensing, target tracking and spatial interaction between devices.

Building on its in-house UWB chips, Chixin continues to expand into high-precision spatial sensing, aiming to supply the underlying sensing layer for intelligence in the physical world.

CX100, CX310 and CX500 Series in Volume Production

According to the company's website, Chixin's core team comes from leading semiconductor design firms in China and abroad, with key staff each carrying more than a decade of industry experience.

The company says it has built a complete technology stack spanning chip design and application solutions, with all core technology developed in-house, covering analog circuits, RF, baseband, algorithms, protocol stack software, application software and hardware designs.

On the product side, its CX100, CX310 and CX500 series UWB chips are already in volume production, and the company has established partnerships and begun shipping to leading customers in consumer electronics, IoT, automotive electronics and industrial markets.

Chixin also offers turnkey services from chip to application solution, helping customers with product design, software adaptation, system integration and production ramp.

Widening Range of Applications

Since the start of this year, Chixin's products have been moving into a broader set of use cases.

In smart homes, its UWB chips support indoor positioning, device linkage, hands-free unlocking and precise control. In smart radar, they provide the underlying layer for target detection, distance measurement and spatial awareness.

In new energy, UWB can be applied to equipment management, personnel positioning and safe operations at smart power stations. In electric vehicles, it supports digital keys, positioning inside and outside the car, smart entry and in-vehicle spatial interaction.

As physical AI, robots and XR devices develop, UWB chips can also serve as a key part of spatial sensing systems, supporting robot positioning, human-device interaction, device-to-device coordination and target recognition in complex environments.

Industrial Capital Steps In to Speed Automotive-Grade Chips

The round was led by Yanpu Precision, a sign of interest from automotive and advanced manufacturing capital in the outlook for UWB chips.

Yanpu Precision chairman Zhou Jianqing said the company is actively expanding into robotics and other emerging productive sectors. The investment in Chixin, he said, is an important step in Yanpu's move upstream in the supply chain and into physical AI spatial sensing technology.

The two companies plan to push domestic UWB chips into Industry 5.0, embodied intelligence and automotive electronics applications, speeding the path from chip development to commercial deployment.

Quectel co-founder and COO Zhang Dong said that as AI, robotics and XR converge, connectivity, computing power and artificial intelligence are forming a new set of industrial dependencies.

Quectel has already worked with Chixin on joint projects. The two will deepen cooperation around smart radar, AI hardware and physical AI, exploring products that combine communications modules with spatial sensing chips.

Pushing for Self-Sufficiency in Domestic UWB Chips

Changsha Lushan Investment Holding Group said Chixin's capabilities in high-end chip development and commercialization align with the AI and semiconductor priorities of the Xiangjiang New Area.

The investment is also part of Lushan Holding's broader positioning across the AI industry and the semiconductor supply chain. Lushan said it will use state capital in a guiding role and draw on local industrial resources to support Chixin's R&D, customer expansion and industry collaboration.

Chixin chairman Jing Zhenhai said closing the A+ round reflects capital market confidence in the company's in-house R&D capability and its technology roadmap in physical AI spatial sensing.

In the next phase, the company plans to increase R&D spending, accelerate volume production and iteration of new products, deepen ties with industry partners, and push domestic UWB chips into large-scale use across more applications.

Physical AI Creates New Demand for Spatial Sensing

As artificial intelligence moves from digital environments into the real world, robots, smart cars, XR devices and connected homes all need a more accurate understanding of their own position, nearby objects and spatial relationships.

UWB chips can give those devices high-precision ranging, positioning and spatial interaction, making them a key foundational component linking digital systems to the physical environment.

Chixin said it will continue to round out its product lineup across chips, algorithms, software and application solutions, with a focus on automotive-grade chips and embodied intelligence products, gradually building a self-sufficient supply chain for physical AI spatial sensing.